・grinder for dedicated soi wafer which needs ultimate ttv level. ・each machine component adopt the low expansion material and avoid the chronological change by thermal deformation. removal amount control soft wafer is available as an option which enable submicron level layer thickness control with no effect of substrate thickness variation.
1926. kakusaburo okamoto established the okamoto special purpose machine tool works as a privately owned company. 1930. with its own technology the company developed an automatic spur gear grinding machine (model asg-2) regarded until then as the most difficult grinding machine to develop.
okamoto is a leading manufacturer of precision grinding and polishing tools since 1935. grinding tools used in applications of wafer manufacturing soi tsv mems thin wafers down to 25 um bonded wafers bumped wafers solar ingot grinding quartz sapphire gaas inp and more.
chnc series grinders provide large grinding capacity with width capability up to 80". their robust design and construction assures long-term precision and dependability when processing large components. versatile grinding cycles boost productivity.
grinding machine semiconductor equipment gear and casting only one for total abrasive machine manufacturer in the world large size 450mm wafer～ please contact us for various inquiries and information on the products of okamoto machine tool manufacturing co. ltd. from the following.
a wide range of machine chuck dimensions from 1200x500mm to 3000x800mm. suited for all types of grinding spindle is a cartridge type sealed and lubricated for life with impeller ventilating heat away from the motor
the semiconductor equipment division supplies systems for ultra-precision finishing categories including grinding cmp/polishing lapping and slicing. okamoto positively promotes research and development in both hardware and software so as to quickly satisfy customers’ requirements for advanced technologies. we will
downfeed grinding technology + index wafer transfer (awarded jsme in 1996) grinding machines use an unique down feed grinding method to maintain a constant down-force to minimize depth of damage and prevent edge chipping and a 360 degree rotating indexing table which enable thin wafer processing without influencing machining accuracy.